PRODUCT
Product Information
Semiconductor Cleaning Equipment
Batch Type Cleaning Equipment
Our cleaning equipment efficiently processes 50 wafers per treatment tank, offering high levels of customization. This flexibility allows for easy modification of the configuration and the number of installed cleaning tanks as needed.
Single Wafer Cleaning Equipment
JET cleaning equipment operates on a one-by-one wafer processing system within a designated chamber or treatment tank. Enhanced with a specialized feature, it utilizes an infrared lamp to heat the chemical solution on each wafer, thereby optimizing processing performance and capacity. This innovation not only improves efficiency but also minimizes the overall consumption of chemical solutions.
Batch Type Cleaning Equipment
Model: BW3700
Cleaning Process
Batch-type cleaning equipment designed for 300-mm wafers
Key Features
- Compact equipment footprint enables increased installations and optimized use of fab space
- Stable processing capacity per treatment tank facilitated by individual exhaust system piping
- Achieves 7-mm wafer pitch processing
- Mitigates particle generation (fine dust) by minimizing wafer contact area
- Minimized bubble generation
- Enhanced liquid replacement efficiency through a reverse flow system
- Improved concentration stability
- Versatility with compatibility for a wide range of treatment tanks
- Supports a configuration of 1 chemical solution plus 1 DIW (Deionized Water) configuration
Model: BW3000
Cleaning Process
Batch-type cleaning equipment designed for 300-mm wafers
Key Features
- Flexible configuration adaptable to diverse customer requirements, allowing adjustment of cleaning tank arrangement and quantity as needed
- Enhanced production efficiency
- High-speed LD/ULD (Load/Unload) support at 500 wafers per hour (WPH)
- Compact equipment footprint facilitates optimal utilization of fab space
- Reduced carbon dioxide emissions
- Achieves control of gas flow rate
- Optimizes standardization and shortens start-up time
- Compatible with SEMI standards
- Supports EES (Equipment Data Acquisition) in either EDA (Equipment Data Acquisition) or TDI (Test Data Interface) formats
Model: BW2000
Cleaning Process
Batch-type cleaning equipment designed for 200-mm wafers
Key Features
- Superior production efficiency
- Exceptional cleaning capability
- Reduced installation footprint
- Flexibility to accommodate changes in treatment tank configuration and quantity
- Customizable per customer’s production requirements
Single Wafer Cleaning Equipment
Model: HTS-300
Cleaning Process
Single-wafer cleaning equipment designed for 300-mm wafers
Key Features
- Achieves processing with minimal chemical consumption, utilizing only 150 cc
- Capable of high-temperature processing up to 240°C
- Strip process completed in as little as 30 seconds
- Effectively prevents fume (chemical vapor) diffusion through wafer inversion processing
- Customizable per customer’s requirements